| Authors: | Fedeli, J.-M., L. Liu, Grenouillet, L., Bordel, D., Mandorlo, F., Olivier, N., T. Spuesens, Regreny, P., Grosse, P., Rojo-Romeo, P., Orobtchouk, R., D. Van Thourhout | | Title: | Towards optical networks-on-chip with 200mm hybrid technology | | Format: | International Conference Proceedings | | Publication date: | 3/2011 | | Journal/Conference/Book: | OFCNFOEC 2011 (Optical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference)
| | Volume(Issue): | p.paper OMM3 (3 pages) | | Location: | Los Angeles, California, United States | | DOI: | 10.1364/ofc.2011.omm3 | | Citations: | 2 (Dimensions.ai - last update: 17/11/2024)
1 (OpenCitations - last update: 3/5/2024)
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Abstract
Integrated components for optical networks-on-chip,
including III-V microdisk lasers, photodetectors, and wavelength
selective circuits, are all demonstrated using a complementary
metal-oxide-semiconductor (CMOS) compatible III-V/silicon-oninsulator
integration technology at 200mm wafer scale. |
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