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Metal bonding with ultra-thin patterned layer for optical applications

Main Researcher: Denis Lauvernier

Adhesive bonding is a well-known technics to assembly dies or wafer on a host substrate through polymer or solder bumps. To bring together electronic and photonic systems on a single chip, a metal like AuSn alloy can be used as bonding medium combined to waferscale technology and post-bonding III-V processing alleviating so the need of alignment accuracy between wafers. By this way, III-V component dimensions can be reduced and heating problems can be solved. For instance, high density LED’s array could be realized on driving CMOS wafer taking benefits from the nice electrical, thermal and mechanical properties of this alloy.

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