Photonics Research Group Home
Ghent University Projects
About People Research Publications Education Services
 IMEC
intern

 
back to project list 

H2020 : PhotonicLEAP

Full Name: ​Photonic Wafer-Level IntEgration PAckaging and Test Processes

Duration: 1/1/2021-31/12/2024

Project Web site: https://photonicleap.com/index.html

People involved

Research topics involved

See also:

  • https://cordis.europa.eu/project/id/101016738

Publications in the framework of this project (3)

    International Journals

  1. E. Dieussaert, R. Baets, H. Jans, X. Rottenberg, Y. Li, Non-contact photoacoustic imaging with a silicon photonics-based Laser Doppler Vibrometer, Scientific Reports, 14, p.22953 doi:10.1038/s41598-024-74266-y (2024)  Download this Publication (2.3MB).
      International Conferences

    1. Y. Li, E. Dieussaert, M. Ghomashi, R. Baets, Silicon photonics-based laser Doppler vibrometer array for non-contact photoacoustic imaging, International Conference on Nano-photonics and Nano-optoelectronics, Japan, p.ICNN5-01 (2024).
    2. M. Ghomashi, R. Baets, Y. Li, Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits, 2023 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), Italy, doi:10.1109/NUSOD59562.2023.10273523 (2023).