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Authors: G. Roelkens, J. Van Campenhout, J. Brouckaert, D. Van Thourhout, R. Baets, P. Rojo Romeo, P. Regreny, A. Kazmierczak, C. Seassal, X. Letartre, G. Hollinger, J.M. Fedeli, L. Di Cioccio, C. Lagahe-Blanchard
Title: III-V/Si photonics by die-to-wafer bonding
Format: International Journal
Publication date: 7/2007
Journal/Conference/Book: materialstoday
Volume(Issue): 10(7-8) p.36-43
DOI: 10.1016/S1369-7021(07)70178-5
Citations: 122 (Dimensions.ai - last update: 18/10/2020)
103 (OpenCitations - last update: 19/10/2020)
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