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Authors: C. Stamatiadis, L. Stampoulidis, K. Vyrsokinos, I. Lazarou, L.Zimmermann, K.Voigt, L. Moerl, J. Kreissl, B. Sedighi, Z. Sheng, P. De Heyn, D. Van Thourhout, M. Karl, T. Wahlbrink, J. Bolten, A. Leinse, R, Heidemann, F. Gomez-Agis, H.J.S Dorren, A. Pagano, E. Riccardi, H. Avramopoulos
Title: The ICT-BOOM project: Photonic Routing on a Silicon-On-Insulator Hybrid Platform
Format: International Conference Presentation
Publication date: 4/2011
Journal/Conference/Book: 15th Conference on Optical Network Design and Modeling (ONDM) (invited)
Location: Bologna, Italy
Citations: Look up on Google Scholar
Download: Download this Publication (697KB) (697KB)


BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip
bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

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