Authors:	S. Keyvaninia, M. Muneeb, S. Stankovic, G. Roelkens, D. Van Thourhout, J.M. Fedeli
Title:	Multiple die-to-wafer adhesive bonding for heterogeneous integration
Format:	International Conference Proceedings
Publication date:	4/2012
Journal/Conference/Book:	16th European Conference on Integrated Optics (ECIO 2012)
Volume(Issue):	p.paper 186
Location:	Barcelona, Spain
Citations:	Look up on Google Scholar
Download:	(264KB)

Abstract

A new process for bonding of 111-V dies to processed
silicon-on-insulator waveguide circuits using divynilsiloxane-bisbenzocycJobutene
(DVS-BCB) was developed using a commercial
wafer bonder. High-quality bonding, with ultra-thin bonding layers « 60 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers.