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Authors: K.S. Kaur, A. Subramanian, P. Cardile, R. Verplancke, J. Van Kerrebrouck, S. Spiga, R. Meyer, J. Bauwelinck, R. Baets, G. Van Steenberge
Title: Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms
Format: International Journal
Publication date: 10/2015
Journal/Conference/Book: Optics Express
Editor/Publisher: OSA, 
Volume(Issue): 23(22) p.28264
Internal Reference: [N-1790]
DOI:
Download: Download this Publication (2.7MB) (2.7MB)

Abstract

This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8 prisms are defined on top of the GCs using non-uniform laser ablation process. The prisms enable perfectly vertical coupling from the bonded VCSELs to the GCs. The VCSELs are flip-chip bonded on top
of the silicon GCs employing the laser-induced forward transfer (LIFT)-assisted thermocompression technique. An excess loss of < 1 dB at 1.55 ┬Ám
measured from the bonded assemblies is reported in this paper. The results of high speed transmission experiments performed on the bonded assemblies with clear eye openings up to 20 Gb/s are also presented


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