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Authors: Kaixuan Chen, Q. Huang, Jianhao Zhang, Jianxin Cheng, X. Fu, Chenzhao Zhang, Keqi Ma, Yaocheng Shi, D. Van Thourhout, G. Roelkens, L. Liu, Sailing He
Title: Wavelength-multiplexed duplex transceiver based on IIIV/Si hybrid integration for off-chip and on-chip optical interconnects
Format: International Journal
Publication date: 1/2016
Journal/Conference/Book: IEEE Photonics Journal
Volume(Issue): 8(1) p.7900910
Internal Reference: [N-1837]
Download: Download this Publication (1.6MB) (1.6MB)

Abstract

A 6-channel wavelength division multiplexed optical transceiver on silicon with a compact footprint for off-chip and on-chip interconnects is demonstrated. An arrayed waveguide grating is used as the (de)multiplexer, and IIIV electro-absorption sections fabricated by hybrid integration technology are used as both modulators and detectors. An aggregate 180 Gb/s capacity for the off-chip transmitter and receiver is demonstrated. For the on-chip interconnect, an electrical-to-electrical 3 dB-bandwidth of 13 GHz and a data rate of 30 Gb/s per wavelength is achieved. A duplex link is possible in the presented transceiver chip due to the identical structure used for the modulator and detector.

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