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Authors: A. De Groote, P. Cardile, A. Subramanian, A. Fecioru, C. Bower, D. Delbeke, R. Baets, G. Roelkens
Title: Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters
Format: International Journal
Publication date: 6/2016
Journal/Conference/Book: Optics Express
Volume(Issue): 24(13) p.13754-13762
Internal Reference: [N-1893]
DOI:

Abstract

We present the first III-V opto-electronic components transfer printed on and coupled to a silicon photonic integrated circuit. Thin InP-based membranes are transferred to an SOI waveguide circuit, after which a single-spatial-mode broadband light source is fabricated. The process flow to create transfer print-ready coupons is discussed. Aqueous FeCl3 at 5C was found to be the best release agent in combination with the photoresist anchoring structures that were used. A thin DVS-BCB layer provides a strong bond, accommodating the post-processing of the membranes. The resulting optically pumped LED has a 3 dB bandwidth of 130 nm, comparable to devices realized using a traditional die-to-wafer bonding method.

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