| Authors: | G. Muliuk, N. Ye, D. Van Thourhout, G. Roelkens | | Title: | High Alignment Accuracy Transfer Printing of Silicon Coupons for Heterogeneously Integrated PICs | | Format: | International Conference Proceedings | | Publication date: | 11/2017 | | Journal/Conference/Book: | Proceedings Symposium IEEE Photonics Society Benelux
| | Volume(Issue): | p.48-51 | | Location: | Delft, Netherlands | | Citations: | Look up on Google Scholar
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Abstract
A process flow is developed for releasing and transfer printing silicon-on-insulator devices. High alignment accuracy (better than ±1um) transfer printing of silicon coupons is demonstrated. Transfer printing alignment markers on source coupons and target wafers were used in a center-to-center alignment method. Notches on the sides of the devices and on the target were implemented for measuring misalignment using scanning electron microscopy. This work proves that transfer-printing technology can be used for the scalable heterogeneous integration of silicon photonic devices with optical interfaces allowing for a +/- 1μm misalignment. Related Research Topics
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