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Authors: N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, B. Snyder
Title: Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Format: International Conference Proceedings
Publication date: 3/2018
Journal/Conference/Book: The Optical Fiber Communication Conference (OFC)
Volume(Issue): p.paper Tu2A.1 (3 pages)
Location: San Diego, United States
DOI: 10.1364/ofc.2018.tu2a.1
Citations: 4 (Dimensions.ai - last update: 19/10/2020)
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