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Authors: P. Bakopoulos, D. Kalavrouziotis, E. Mentovich, P. Ossieur, G. Roelkens, J. Van Campenhout
Title: Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects
Format: International Conference Proceedings
Publication date: 6/2019
Journal/Conference/Book: PhotonIcs & Electromagnetics Research Symposium (PIERS) (invited)
Location: Rome, Italy
Citations: Look up on Google Scholar

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