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Authors: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, R. Baets, A. Trindade, C. Bower, R. Baets
Title: III-V/Si PICs based on micro-transfer-printing
Format: International Conference Proceedings
Publication date: 3/2019
Journal/Conference/Book: Optical Fiber Communication Conference (invited)
Volume(Issue): p.paper W4E.6 (3 pages)
Location: San Diego, United States
Citations: Look up on Google Scholar

Abstract

III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.

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