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Authors: L. Zimmermann, H. Schroeder, T. Tekin, W. Bogaerts, P. Dumon
Title: g-Pack – a generic testbed package for Silicon photonic devices
Format: International Conference Proceedings
Publication date: 9/2008
Journal/Conference/Book: Group IV Photonics
Volume(Issue): p.FB4
Location: Sorrento, Italy
DOI: 10.1109/group4.2008.4638203
Citations: 4 (Web of Knowledge / Dimensions.ai - last update: 27/9/2020)
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Download: Download this Publication (613KB) (613KB)

Abstract

g-Pack is a low-frequency packaging approach to
breadboarding of Silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier.

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