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Authors: Fedeli, J.-M., L. Liu, Grenouillet, L., Bordel, D., Mandorlo, F., Olivier, N., T. Spuesens, Regreny, P., Grosse, P., Rojo-Romeo, P., Orobtchouk, R., D. Van Thourhout
Title: Towards optical networks-on-chip with 200mm hybrid technology
Format: International Conference Proceedings
Publication date: 3/2011
Journal/Conference/Book: OFCNFOEC 2011 (Optical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference)
Volume(Issue): p.paper OMM3 (3 pages)
Location: Los Angeles, California, United States
DOI: 10.1364/ofc.2011.omm3
Citations: 2 (Dimensions.ai - last update: 21/2/2021)
1 (OpenCitations - last update: 8/2/2021)
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Abstract

Integrated components for optical networks-on-chip,
including III-V microdisk lasers, photodetectors, and wavelength
selective circuits, are all demonstrated using a complementary
metal-oxide-semiconductor (CMOS) compatible III-V/silicon-oninsulator
integration technology at 200mm wafer scale.


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