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Authors: J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, E. Gocolinska, B. Corbett, A. Jose Trindade, C. Bowers, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens
Title: Micro-Transfer-Printing for III-V/Si PICs
Format: International Conference Proceedings
Publication date: Accepted for publication. Not yet published
Journal/Conference/Book: Asian Communication and Photonics Conference (invited)
Location: Beijing, China
Citations: Look up on Google Scholar

Abstract

Micro-transfer-printing (uTP) enables the intimate integration of a variety of
III-V opto-electronic components on silicon photonic integrated circuits (Si PICs). It allows
for the scalable manufacturing of complex III-V/Si PICs at low cost.

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