Authors:	G. Roelkens, D. Van Thourhout, I. Christiaens, R. Baets, M.K. Smit
Title:	Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components
Format:	International Conference Presentation
Publication date:	4/2005
Journal/Conference/Book:	ECIO 2005
Location:	Grenoble, France
Citations:	Look up on Google Scholar
Download:	(802KB)

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