Publication detail

Authors:	A. Masood, W. Bogaerts, J. Van Olmen, J. Van Aelst, D. Van Thourhout, D. Sabuncuolu Tezcan
Title:	Photonics-CMOS 3D integration: copper through-silicon-via approach
Format:	International Conference Proceedings
Publication date:	11/2009
Journal/Conference/Book:	Proceedings of the 2009 Annual Symposium of the IEEE Photononics Benelux Chapter
Volume(Issue):	p.165-168
Location:	Brussels, Belgium
Internal Reference:	[N-935]
Download:	(329KB)

Related Research Topics

• 3D Integration of Photonics & CMOS using Cu Through-Silicon-Via

Related Projects

• ICT: HELIOS (pHotonics ELectronics functional Integration on CMOS)