Authors:	J.M. Fedeli, E. Augendre, J.-M. Hartmann, L. Vivien, P. Grosse, V. Mazzocchi, W. Bogaerts, D. Van Thourhout, F. Schrank
Title:	Photonics and Electronics Integration in the HELIOS project
Format:	International Conference Proceedings
Publication date:	9/2010
Journal/Conference/Book:	Group IV Photonics 2010
Volume(Issue):	p.FC2
Location:	Beijing, China
DOI:	10.1109/group4.2010.5643326
Citations:	11 (Dimensions.ai - last update: 17/11/2024) 7 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
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Abstract

The objective of the European project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics processes. Bonding of AWG + Ge Photodiodes on CMOS wafer is achieved.

Related Research Topics

• 3D Integration of Photonics & CMOS using Cu Through-Silicon-Via (2008-2013)

Related Projects

• ICT: HELIOS (pHotonics ELectronics functional Integration on CMOS)