| Authors: | G. Duan, C. Jany, A. Le Liepvre, M. Lamponi, A. Accard, F. Poingt, D. Make, F. Lelarge, S. Messaoudene, D. Bordel, J.M. Fedeli, S. Keyvaninia, G. Roelkens, D. Van Thourhout, D. Thomson, F. Gardes, G. Reed | | Title: | III-V on Silicon Transmitters | | Format: | International Conference Proceedings | | Publication date: | 3/2013 | | Journal/Conference/Book: | Conference on Optical Fiber Communication (OFC) and the National Fiber Optic Engineers Conference (NFOEC), (2013)
(invited)
| | Location: | United States | | DOI: | 10.1364/ofc.2013.om3k.4 | | Citations: | 2 (Dimensions.ai - last update: 17/11/2024)
1 (OpenCitations - last update: 10/5/2024)
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Abstract
Recent advances on hybrid III-V/Si transmitters using a wafer bonding technique are
reported. In particular, widely tunable III-V/Si lasers exhibiting 45 nm tuning range and hybrid
tunable transmitters integrating a silicon Mach-Zehnder modulator are demonstrated. Related Research Topics
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