Photonics Research Group Home
Ghent University Journals/Proceedings
About People Research Publications Education
 IMEC
intern

 

Publication detail

Authors: S. Keyvaninia, M. Muneeb, S. Stankovic, René van Veldhoven, D. Van Thourhout, G. Roelkens
Title: Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
Format: International Journal
Publication date: 1/2013
Journal/Conference/Book: Optical Materials Express
Editor/Publisher: OSA, 
Volume(Issue): 3(1) p.35-46
Internal Reference: [N-1383]
Download: Download this Publication (965KB) (965KB)

Abstract

Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one of the most promising
methods for the fabrication of active photonic devices in silicon photonics. For
this integration, it is essential to have a reliable and robust bonding procedure,
which also provides a uniform and ultra-thin bonding layer for an effective optical
coupling between III-V active layers and SOI waveguides. A new process for
bonding of III-V dies to processed silicon-on-insulator waveguide circuits using
divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a
commercial wafer bonder. This ‘cold bonding’ method significantly simplifies the
bonding preparation for machine-based bonding both for die and wafer-scale
bonding. High-quality bonding, with ultra-thin bonding layers (< 50 nm) is
demonstrated, which is suitable for the fabrication of heterogeneously integrated
photonic devices, specifically hybrid III-V/Si lasers.

Related Research Topics

Related Projects


Back to publication list