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Authors: J.-M. Fedeli, F. Schrank, W. Bogaerts, A. Masood, L.Zimmermann, E. Augendre, S. Bernabe, J. Kraft, P. Grosse, T. Enot
Title: Electronic-Photonic Integration in the Helios Project
Format: International Conference Proceedings
Publication date: 8/2013
Journal/Conference/Book: Group IV Photonics (invited)
Editor/Publisher: IEEE, 
Volume(Issue): p.FB1
Location: Seoul, South Korea
DOI: 10.1109/group4.2013.6644413
Citations: 1 ( - last update: 14/7/2024)
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Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria

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