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Authors: Y. Xing, J. Dong, U. Khan, W. Bogaerts
Title: Hierarchical Model for Spatial Variations of Integrated Photonics
Format: International Conference Proceedings
Publication date: 8/2018
Journal/Conference/Book: IEEE International Conference on Group IV Photonics
Editor/Publisher: IEEE, 
Volume(Issue): p.91-92 (WD4)
Location: Cancun, Mexico
DOI: 10.1109/GROUP4.2018.8478733
Citations: 5 (Dimensions.ai - last update: 26/10/2020)
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Download: Download this Publication (4.4MB) (4.4MB)

Abstract

The paper presents a hierarchical model that decomposes the spatial process variations of integrated photonics into different levels. We performed an analysis of automated wafer measurements and derived systematic intra-wafer variation and systematic intra-die variation of the wafer.

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