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Authors: X. Jia, J. Roels, R. Baets, G. Roelkens
Title: On-Chip Non-Dispersive Infrared CO2 Sensor Based On an Integrating Cylinder
Format: International Journal
Publication date: 9/2019
Journal/Conference/Book: Sensors
Editor/Publisher: MDPI, 
Volume(Issue): 19(19) p.1-14
DOI: 10.3390/s19194260
Citations: 27 ( - last update: 14/7/2024)
22 (OpenCitations - last update: 27/6/2024)
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In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides. A detailed analysis of the proposed sensor is presented. Simulation with 3D ray tracing shows that an integrating cylinder with 4 mm diameter gives an equivalent optical path length of 3.5 cm. The sensor is fabricated using Deep Reactive Ion Etching (DRIE) and wafer bonding. The fabricated sensor was evaluated by performing a CO2 concentration measurement, showing a limit of detection of ∼100 ppm. The response time of the sensor is only ∼2.8 s, due to its small footprint. The use of DRIE-based waveguide structures enables mass fabrication, as well as the potential co-integration of flip-chip integrated midIR light-emitting diodes (LEDs) and photodetectors, resulting in a compact, low-power, and low-cost NDIR CO2 sensor.

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