Authors:	P. Edinger, G. Jo, S.J. Bleiker, A.Y. Takabayashi, N. Quack, P. Verheyen, U. Khan, W. Bogaerts, C. Antony, F. Niklaus, K.B. Gylfason
Title:	An Integrated Platform for Cavity Optomechanics with Vacuum-Sealed Silicon Photonic MEMS
Format:	International Conference Proceedings
Publication date:	6/2023
Journal/Conference/Book:	2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
Volume(Issue):	p.425-428
Location:	Kyoto, Japan
Online:	https://ieeexplore.ieee.org/document/10516844/
Citations:	Look up on Google Scholar
Download:	(1.8MB)

Abstract

Silicon photonics is an excellent platform for integrated cavity optomechanics due to silicon's high light confinement and favorable mechanical properties. However, optomechanical devices require a vacuum environment to inhibit damping due to air.We present an integrated platform for cavity optomechanics using thermo-compression bonding of silicon caps to provide on-chip vacuum sealing. We demonstrate optomechanical coupling in a vacuum-sealed ring resonator implemented on the platform, either by modulation of the laser power or by using an electrostatic phase shifter in the ring.By enabling optomechanics on a standard platform, we aim to make the technology available to a wider user base.

Related Research Topics

• MEMS and NEMS optical actuators in SOI

Related Projects

• H2020: MORPHIC (MEMS-based zerO-power Reconfigurable Photonic ICs)
• Horizon Europe: PHORMIC (Wafer-scale platform for Photonic Programmable Multipurpose Integrated Circuits)