| Authors: | A. Kumar Mallik, J.S. Lee, S. Collins, C. Antony, U. Khan, P. Edinger, G. Jo, I. Zand, F. Niklaus, K.B. Gylfason, N. Quack, W. Bogaerts, P. Morrissey, P. O'Brien | | Title: | Development of Electrical and Optical Packaging for Silicon Photonic MEMS | | Format: | International Conference Proceedings | | Publication date: | 11/2024 | | Journal/Conference/Book: | IEEE Photonics Conference
| | Volume(Issue): | p.ThD1.4 | | Location: | Rome, Italy | | Citations: | Look up on Google Scholar
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Abstract
We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72channel fiber array to couple to on-chip fiber grating couplers with minimal transmission loss at 1543nm wavelength. Related Research Topics
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