Advanced packaging techniques for parallel optical interconnects modules
Research Area: Photonics packaging
Main Researcher: Olivier Rits
The development of packaging technologies for parallel optical interconnects modules requires multi-disciplinary thinking. Each design is determined by thermal, optical, electrical and mechanical constraints. The optical coupling is perhaps the biggest challenge compared to traditional packaging of electronic chips. Parallel optical interconnect modules should couple to an optical connector, requiring precision alignment features and a transparant interface.
Assembling the opto-electronic hybrid, the package and the alignment plate (spacer plate) into one opto-electronic module
The technique we developed allows for an accurate 3-D alignment of two independent objects, for example a connector guiding part and a package. The technique can be extended to mount other objects as microlens arrays on packages.
Spacer plate mounted on a ceramic package.
Other people involved:
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