IST: IO

Full Name: Interconnect by Optics

Duration: 1/9/2001-1/8/2004 (Finished)

Partners:

• IMEC participates in this project with three groups:
  • Ghent University, department of Information Technology (INTEC)
  • Ghent University, department of ELIS, TFCG group
  • Ghent University, department of ELIS, Paris group
• Alcatel Bell N.V.
• Avalon Photonics Ltd
• Opto Speed SA
• Helix AG
• FCI 's hertogenbosch, more specific the Fiber optic division.
• Nexans
• R.C.I
• PPC Electronic AG
• Commisariat à l'Energie Atomique CEA (LETI), more specific the optronic department.

Objective:

• We will develop an optical interconnect family for a high data rate, 2D array optical interconnect between ICs, applicable at the IC-access, board level and at the board-to-board level. The approach is based on optical waveguides that are integrable with printed circuit boards, either as a post-solder build-up extension or as a solder-compatible optical layer. The optical waveguides will be based on novel Plastic Optical Fibres, and on advanced layered Glass Sheets with waveguides. Key target parameters aimed for are: channel density from 16/mm 2 (first generation) to 64/mm 2 , number of channels (at optical interfaces) ranging from 64 (first generation), to 256, data rate between 1.25 Gb/s and 2.5 Gb/s or higher. We will demonstrate a complete optical interconnect technology family in a major application area, being that of core IP routers.

INTEC's Role:

• Prime contractor
• Development of packaginig techniques for optical interface to CMOS IC
• Modelling of parallel optical interconnections

Project Web site: http://www.intec.rug.ac.be/IO

People involved

• Roel Baets
• Hannes Lambrecht
• Olivier Rits

Research topics involved

• Parallel optical interconnect systems (2001-2006)
• Advanced packaging techniques for parallel optical interconnects modules (2002-2006)