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Photonics packaging

In this research area the important issue of efficient and cost-effective fiber-to-chip coupling is studied. The main emphasis is on high efficiency fiber-to-chip diffractive grating couplers and inverted taper spotsize converters. Novel approaches for the passive alignment of a fiber (array) with a silicon-based photonic integrated circuit are studied. Besides optical packaging, also novel approaches towards the co-integration of electronic ICs and photonic ICs are developed.

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