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SBO: GigaPixel

Full Name: CMOS imager scaling below wavelength limits

Duration: 1/10/2021-30/12/2024


  • IMEC
  • KU Leuven
  • UGent


  • Color splitter design:
  • This involves the design and optimization of vertical waveguide structures, taking into account the boundary conditions set by the process technology and the development of a fast design parameter screening procedure, using advanced optimization strategies.
  • Vertical waveguide array fabrication:
  • Process development and stack fabrication using state-of-the-art 300mm equipment. Follow up of process steps and full stack fabrication with analysis methods using focused ion beam preparation, high resolution scanning electron microscopy, and scanning probe microscopy.
  • Optical characterization:
  • Vertical waveguide stack analysis of transmitted light by confocal microscopy and scanning near-field optical microscopy.
  • High temperature stable thin film photodetector:
  • Development of high temperature (>350°C) stable perovskite photodetectors including layers with charge transport and charge blocking properties for the opposite charge. A high quantum efficiency over the full optical spectrum is targeted with low dark current densities.
  • Full device integration:
  • Proof-of-concept designs of the combination of read-out backplane, thin film photodetector and vertical waveguide stack should demonstrate the capabilities of the proposed GigaPixel concept over state-of-the-art sensor technology. Different optical waveguide designs are benchmarked for their application feasibility.

INTEC's Role:

  • Optical characterization of colour splitters

People involved

Publications in the framework of this project (1)

        International Conferences

      1. S. Kang, M. Benelajla, R. Mac Ciamain, F. Ali, A. Papadopoulou, O. Shramkova, L. Witters, J. De Vos, P.E. Malinowski, P. Heremans, N. Le Thomas, B. Figeys, R. Gehlhaar, J. Genoe, Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters, IEEE IEDM, Paper ID(1404), United States, (2023).