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Authors: S. Kang, M. Benelajla, R. Mac Ciamain, F. Ali, A. Papadopoulou, O. Shramkova, L. Witters, J. De Vos, P.E. Malinowski, P. Heremans, N. Le Thomas, B. Figeys, R. Gehlhaar, J. Genoe
Title: Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters
Format: International Conference Proceedings
Publication date: 9/2023
Journal/Conference/Book: IEEE IEDM
Editor/Publisher: IEEE, 
Volume(Issue): Paper ID(1404)
Location: San Francisco, United States
Citations: Look up on Google Scholar


We demonstrate a new technology for splitting
colors with sub-micron resolution using standard backend processing on 300 mm wafers. The color splitting is tunable via the geometry and can be designed to correspond to the color sensitivity of the human eye. The technology can result in: higher signal-to-noise ratio, better color quality and enhanced resolution for high-end cameras.

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