| Authors: | S. Kang, M. Benelajla, R. Mac Ciamain, F. Ali, A. Papadopoulou, O. Shramkova, L. Witters, J. De Vos, P.E. Malinowski, P. Heremans, N. Le Thomas, B. Figeys, R. Gehlhaar, J. Genoe | | Title: | Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters | | Format: | International Conference Proceedings | | Publication date: | 9/2023 | | Journal/Conference/Book: | IEEE IEDM
| | Editor/Publisher: | IEEE, | | Volume(Issue): | Paper ID(1404) | | Location: | San Francisco, United States | | Citations: | Look up on Google Scholar
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Abstract
We demonstrate a new technology for splitting
colors with sub-micron resolution using standard backend processing on 300 mm wafers. The color splitting is tunable via the geometry and can be designed to correspond to the color sensitivity of the human eye. The technology can result in: higher signal-to-noise ratio, better color quality and enhanced resolution for high-end cameras. Related Research Topics
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