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Authors: G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Notzel, M. Smit
Title: Adhesive Bonding of InP/InGaAsP Dies to Processed Silicon-on-Insulator Wafers using DVS-bis-Benzocyclobutene
Format: International Journal
Publication date: 11/2006
Journal/Conference/Book: Journal of Electrochemical Society
Volume(Issue): 153(12) p.G1015-G1019
DOI: 10.1149/1.2352045
Citations: 98 (Dimensions.ai - last update: 18/10/2020)
90 (OpenCitations - last update: 19/10/2020)
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