IST: PICMOSFull Name: Photonic Interconnect Layer on CMOS by wafer-scale integration Duration: 1/1/2004-31/3/2007 (Finished) Partners: - IMEC - INTEC(BE)
- ST Microelectronics (FR)
- CEA (FR)
- TRACIT Technologies (FR)
- CNRS-FMNT (FR)
- NCSR-Demokritos (GR)
- TU/E (NL)
Objective: - Demonstrate the feasibility of adding a photonic interconnect layer on top of silicon ICs containing CMOS-circuitry, with the photonic layer created by a combination of wafer bonding and wafer-scale processing steps
INTEC's Role: - Project coordination, development of SOI wiring circuits, development of III-V sources bonded on SOI circuits
Project Web site: http://picmos.intec.ugent.be People involved
Research topics involved
|