| Authors: | J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower | | Title: | Micro-transfer printing for photonic integrated circuits | | Format: | International Conference Proceedings | | Publication date: | 10/2019 | | Journal/Conference/Book: | International Conference on Wafer Bonding (WaferBond)
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Abstract
Micro-transfer-printing is a promising technology for the realization of complex and powerful photonic integrated circuits. It enables the manipulation micro-components in a massively parallel manner and allows for the scalable integration of diverse functionalities on silicon photonic platforms at low-cost. Related Research Topics
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