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| 157 |
Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate,
S. Keyvaninia, M. Muneeb, S. Stankovic, René van Veldhoven, D. Van Thourhout, G. Roelkens,
Optical Materials Express, 3(1), p.35-46 doi:10.1364/ome.3.000035 (2013) |  |
| 85 |
Hybrid III-V/Si Distributed Feedback Laser Based on Adhesive Bonding,
S. Stankovic, Jones, Richard, Sysak, Matthew, Heck, John, G. Roelkens, D. Van Thourhout,
IEEE Photonics Technology Letters, 24(23), p.2155-2158 doi:10.1109/lpt.2012.2223666 (2012) | |
| 62 |
1310 nm Hybrid III-V/Si Fabry-Perot Laser Based on Adhesive Bonding,
S. Stankovic, Jones, Richard, Sysak, Matthew, Heck, John, G. Roelkens, D. Van Thourhout,
IEEE Photonics Technology Letters, 23(23), p.1781-1783 doi:10.1109/lpt.2011.2169397 (2011) | |
| 25 |
Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic Devices,
S. Stankovic, Jones, Richard, Heck, John, Sysak, Matthew, D. Van Thourhout, G. Roelkens,
Electrochemical and Solid-State Letters, 14(8), p.H326-H329 doi:10.1149/1.3592267 (2011) | |
| 10 |
Die-to-die adhesive bonding for evanescently-coupled photonic devices,
S. Stankovic, D. Van Thourhout, G. Roelkens, R. Jones, J. Heck, M. Sysak,
218th ECS Meeting, Symposium on Wafer Bonding / ECS Transactions, 33(4), United States, p.411-420 doi:10.1149/1.3483531 (2010) | |
Types of Publications
Invited Publications
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