Authors:	I. Christiaens, G. Roelkens, K. De Mesel, D. Van Thourhout, R. Baets
Title:	Thin film devices fabricated with BCB waferbonding
Format:	International Journal
Publication date:	2/2005
Journal/Conference/Book:	Journal of Lightwave Technology
Volume(Issue):	23(2) p.517
DOI:	10.1109/JLT.2004.841783
Citations:	45 (Dimensions.ai - last update: 17/11/2024) 30 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
Download:	(1.1MB)

Related Research Topics

• Microring resonators (2000-2004)
• Die-to-wafer bonding technology (2003-2012)

Related Projects

• IST: NEWTON (NEw Widely Tunable lasers for Optical Networks)
• IWT: GBOU (Generic Technologies for Plastic Photonics)
• IST: PICMOS (Photonic Interconnect Layer on CMOS by wafer-scale integration)