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Authors: W. Bogaerts, H. Deng, X. Chen, L. Van Iseghem, I. Zand, Y. Zhang, Y. Liu, A. Al Haffar, P. Edinger, G. Jo, A.Y. Takabayashi, C. Antony, A. Mallik Kumar, J. Zhang, E. Soltanian, P. Verheyen, J. Beeckman, G. Roelkens, N. Quack, F. Niklaus, K.B. Gylfason, U. Khan
Title: Building general-purpose programmable photonic chips: opportunities and challenges
Format: International Conference Presentation
Publication date: 2/2024
Journal/Conference/Book: SPIE Photonics West - OPTO (invited)
Editor/Publisher: SPIE, 
Volume(Issue): 12890 p.12890-55
Location: San Francisco, United States
DOI: 10.1117/12.3009922
Citations: Look up on Google Scholar
Download: Download this Publication (329KB) (329KB)


Photonic chips are becoming increasingly complex, combining even more optical building blocks on the same chip. With this growing complexity we also see an expanding need for, and use of electrical tuning. This imposes opportunities, as photonic circuits can now become reconfigurable at run time, even to the point of creating arbitrary connectivity between functional building blocks, serving as a general-purpose optical processor. But at the same time, large-scale configurability comes with some tremendous challenges in terms of power consumption, electrical and optical packaging, driver electronics and control algorithms. We will discuss our recent progress in these domains in our path to building general-purpose programmable photonic chips. Expanding silicon photonics with high-efficiency electro-optic tuners, high-density packaging solutions, and electronics and software layers to govern the behavior of these photonic circuits that can be used for both photonic and microwave analog signal processing.

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