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ECSELMICROPRINCE

ECSEL: MICROPRINCE

Full Name: micro transfer printing on 200mm wafers

Duration: 1/4/2017-1/10/2020 (Finished)

Partners:

  • X-FAB MEMS and semiconductor foundries
  • Melexis
  • X-Celeprint
  • Huawei
  • Optics Balzers
  • Fraunhofer IMWS
  • Tyndall
  • TU Dresden

Objective:

  • The MICROPRINCE project is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (μTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transferred to target wafer to demonstrate the capabilities of the technology.

INTEC's Role:

  • Develop and transfer the micro-transfer printing of III-V opto-electronic components to a foundry environment.

Project Web site: https://microprince.eu

People involved

Research topics involved

Publications in the framework of this project (5)

    International Journals

  1. J. Goyvaerts, S. Kumari, S. Uvin, J. Zhang, R. Baets, A. Gocalinska, E. Pelucchi, B. Corbett, G. Roelkens, Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications, Optics Express, 28(14), p.21275-21285 doi:10.1364/OE.395796 (2020)  Download this Publication (1.9MB).
  2. G. Chen, J.J. Goyvaerts, S. Kumari, J. Van Kerrebrouck, M. Muneeb, S. Uvin, Yu, Yu, G. Roelkens, Integration of high-speed GaAs metal-semiconductor-metal photodetectors by means of transfer printing for 850 nm wavelength photonic interposers, Optics Express, 26(5), p.6351-6359 doi:10.1364/oe.26.006351 (2018)  Download this Publication (2.5MB).
  3. J. O'Callaghan, R. Loi, E.E.Mura, B.Roycroft, A.J.Trindade, K.Thomas, A.GoCalinska, E.Pelucchi, J. Zhang, G. Roelkens, C.A.Bower, B.Corbett, Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices, Optical Materials Express, 7(12), p.4408-4414 doi:10.1364/ome.7.004408 (2017)  Download this Publication (2.5MB).
    Book / Book Chapter

  1. B. Corbett, R. Loi, J. O'Callaghan, G. Roelkens, Transfer printing for silicon photonics, Semiconductors and Semimetals (invited), 99, p.43-70 (2018)  Download this Publication (2.2MB).
    International Conferences

  1. J. Goyvaerts, S. Kumari, S. Uvin, J. Zhang, R. Baets, A. Gocalinska, E. Pelucchi, B. Corbett, G. Roelkens, Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride photonic integrated circuits, Annual Conference of the IEEE Photonics Society, Canada, p.1-2 doi:10.1109/IPC47351.2020.9252495 (2020)  Download this Publication (489KB).