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H2020CALADAN

H2020: CALADAN

Full Name: Micro assembled Terabit/s capable optical transceivers for Datacom applications

Duration: 1/1/2019-31/12/2022

Partners:

  • imec
  • FiconTex
  • EVG
  • Xilinx
  • Mellanox
  • X-Celeprint
  • Innolume
  • IHP
  • Tyndall

Objective:

  • The CALADAN project brings together a supply chain that will enable automatic wafer scale assembly of Terabit/s capable optical engines through the use of the micro transfer printing technology. SiGe BiCMOS drivers and receivers and GaAs quantum dot lasers will be integrated onto Silicon Photonic integrated circuits, fully at the wafer level.

INTEC's Role:

  • Develop transfer printing processes for GaAs QD lasers on iSIPP50G

Project Web site: http://www.caladan.tech/homepage.php

People involved

Research topics involved

Publications in the framework of this project (1)

        International Conferences

      1. J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, E. Gocolinska, B. Corbett, A. Jose Trindade, C. Bowers, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens, Micro-Transfer-Printing for III-V/Si PICs, (invited) publication in Asian Communication and Photonics Conference, China,  (to be published).